Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate
US7595454B2 · kind B2 · utility
45Cited by
14References
22Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 1, 2006 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Oct 3, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a circuitized substrate in which pairs of vertically oriented though holes are formed such that at least one of the through holes is partially embedded within a lower one, thus assuring a sound connection following subsequent lamination or other steps the substrate including such holes is subjected to during manufacture. An electrical assembly including a substrate with such features is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.