Determining the thermal influence of components within a system and usage of a matrix for power and thermal management
US7596464B2 · kind B2 · utility
29Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2004 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | Oct 7, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of creating a thermal influence table to describe thermal relationships between components in a system and use of the thermal influence table in a system is described. The thermal influence matrix may be generated dynamically for a system. The matrix may be used by a thermal management policy to enable a hot device to be cooled by power management of another device in the system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.