Method for mounting a flip chip on a substrate
US7597234B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2006 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Jul 30, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention concerns a method for mounting a semiconductor chip with bumps on one surface onto a substrate location of a substrate, whereby the bumps are brought into contact with corresponding pads on the substrate location. Reference marks are attached to the bondhead that enable measurement of the actual position of the semiconductor chip as well as measurement of the actual position of the substrate location in relation to a system of coordinates defined by the reference marks. Positional displacement of the individual components of the assembly machine caused by thermal influences can be compensated without perpetual calibration procedures having to be carried out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.