Patrick Blessing
4Patents
3h-index
3Co-inventors
39Inventor score
Filing activity: Sep 10, 2004 → Oct 8, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7597234B2 | Method for mounting a flip chip on a substrate | Electricity | 8 | Active |
| US8133823B2 | Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate | Physics | 6 | Active |
| US8166637B2 | Apparatus for mounting a flip chip on a substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US7193727B2 | Apparatus and method for mounting or wiring semiconductor chips | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.