System and method to increase die stand-off height
US7598124B2 · kind B2 · utility
2Cited by
2References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2006 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Oct 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a first face of a die and a second face of a substrate, the substrate positioned generally parallel with, and spaced apart from, the die, and the first face being opposite the second face. The plurality of separator pedestals are operable to selectively force the die and substrate apart, increasing the stand-off height of the flip chip assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.