Pattern data verification method, pattern data creation method, exposure mask manufacturing method, semiconductor device manufacturing method, and computer program product
US7600213B2 · kind B2 · utility
4Cited by
4References
16Claims
0Family size
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Key dates
| Filing date | Nov 28, 2005 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Aug 14, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A pattern data verification method includes preparing exposure data related to a circuit pattern to be formed on a substrate, calculating a characteristic of an image of an exposure pattern on a resist film to be applied on the substrate, the exposure pattern corresponding to the exposure data, calculating a film thickness of the resist film after being developed based on the characteristic of the image of the exposure pattern, and determining whether the exposure data is acceptable or rejectable based on the film thickness of the resist film after being developed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.