Disturbance-free, recipe-controlled plasma processing system and method
US7601240B2 · kind B2 · utility
6Cited by
4References
2Claims
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Key dates
| Filing date | Feb 3, 2006 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | May 15, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plasma processing system includes a first unit for plasma-processing a sample based on a recipe for plasma processing, and a second unit for modifying the recipe in accordance with a monitored value obtained during the plasma processing of the sample in the first unit. A next sample is plasma processed in the first unit based on the modified recipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.