Integrated thermal unit having a shuttle with a temperature controlled surface
US7601934B2 · kind B2 · utility
4Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2007 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Oct 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67748
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated thermal unit comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate transfer shuttle configured to transfer substrates from the bake plate to the cool plate, wherein the substrate transfer shuttle has a temperature controlled substrate holding surface that is capable of cooling a substrate heated by the bake plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.