Programmable capacitor associated with an input/output pad
US7602039B2 · kind B2 · utility
1Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2002 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Jul 15, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.