Thin module system and method
US7602613B2 · kind B2 · utility
7Cited by
272References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2007 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Jan 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit has contacts for mounting in a socket or card edge connector. The flexible circuit includes integrated circuit devices mounted on both sides of the edge connector contacts. Preferably, the flexible circuit is wrapped about an edge of a rigid substrate and presents contacts on both sides of the substrate for mounting in a socket. Multiple flexible circuits may be overlaid with the same strategy. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.