Method of overmolding an electronic assembly having an insert-molded vertical mount connector header
US7603770B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2007 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Sep 28, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4922
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic assembly including a vertical mount connector header is overmolded to form an encapsulated module. Conductor pins retained in the connector header are coupled to a circuit board to support the connector header with respect to the circuit board, leaving an open space between the connector header and the circuit board. The electronic assembly is then placed in a mold for plastic encapsulation. The floor of the mold has a well sized to accommodate the conductor pins and shroud of the connector header, and the connector header has a peripheral flange that seats against the floor of the mold to keep encapsulant out of the well. Encapsulant fills open spaces inboard of the connector header, and a connector insert disposed between the connector header and the floor of the well prevents distention of the connector header and circuit board due to the packing pressure of the encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.