Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor
US7603908B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2008 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Mar 11, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.