Inventor · Tokyo, JP

Shinsuke Asada

14Patents
4h-index
29Co-inventors
56Inventor score

Filing activity: Nov 28, 2005 → Dec 9, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US7862874B2 Welded resin material Emerging Cross-Sectional Technologies 4 Active
US8749977B2 Power semiconductor module and its attachment structure Electricity 4 Active
US9129949B2 Power semiconductor module Electricity 4 Active
US7391101B2 Semiconductor pressure sensor Electricity 4 Active
US7412895B2 Semiconductor pressure sensor and die for molding a semiconductor pressure sensor Electricity 3 Active
US8597755B2 Resin welded body and manufacturing method thereof Emerging Cross-Sectional Technologies 2 Active
US7603908B2 Semiconductor pressure sensor, manufacturing method thereof, and die for molding semiconductor pressure sensor Electricity 2 Active
US9917064B2 Semiconductor device with a plate-shaped lead terminal Electricity 2 Active
US9698091B2 Power semiconductor device Electricity 1 Active
US8110062B2 Welding method and welding apparatus for resin member Performing Operations; Transporting 1 Active
US11901326B2 Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device Electricity 0 Active
US10388581B2 Semiconductor device having press-fit terminals disposed in recesses in a case frame Electricity 0 Active
US10573570B2 Semiconductor device and power conversion device Electricity 0 Active
US9691730B2 Semiconductor device and method for manufacturing the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.