Inlaid polishing pad
US7604530B2 · kind B2 · utility
6Cited by
29References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 15, 2007 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Feb 15, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A surface treatment or a two-step injection molding is used to make an inlaid polishing pad. A surface of the inlaid polishing pad has areas of different rigidity to control the rigidity and compressibility of the inlaid polishing pad. Furthermore, methods of making such an inlaid polishing pads are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.