Patent · US Active

Sealants for metal interconnect protection in microelectronic devices having air gap interconnect structures

US7605073B2 · kind B2 · utility

7Cited by

3References

12Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Adrien LaVoie · Newberg, US
Arnel M. Fajardo · Beaverton, US
Vijayakumar Ramachandrarao · Hillsboro, US

Key dates

Filing date	May 19, 2006
Grant date	Oct 20, 2009
Priority date	—
Expiry date	Jun 21, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/53238
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the invention include apparatuses and methods relating to air gap interconnect structures having interconnects protected by a sealant. In various embodiments, the sealant includes alumina or silicon nitride. In some embodiments, the interconnect structures include cobalt alloy liners and cobalt shunts to encase a conductive material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.