Patent · US Active

Chip module and chip card

US7605453B2 · kind B2 · utility

26Cited by

4References

36Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Peter Stampka · Burglengenfeld, DE
Frank Puschner · Kelheim, DE
Erik Heinemann · Regensburg, DE
Birgit BINDER · Straubing, DE

Key dates

Filing date	Aug 11, 2006
Grant date	Oct 20, 2009
Priority date	—
Expiry date	Jan 29, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A chip module and to a chip card with a chip module which can be bent in such a way that a cross-sectional area runs along the greatest curvature of the bending line and parallel to one side of the chip module or the chip card. The module comprises contact areas within a surrounding line which are arranged in a plane perpendicular to the cross-sectional area, the surrounding line comprising a first line portion, which is adjacent the cross-sectional area, and a second line portion, which is opposite the first line portion. Furthermore, the module comprises a component, which is positioned in such a way that a first distance between the component and the first line portion is greater than a second distance between the component and the second line portion.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.