Semiconductor structure with RF element
US7607586B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 20, 2005 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Apr 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A RF structure including a semiconductor chip with an RF element having an RF core with two electrically connected chip pads, including a chip carrier having two carrier pads connected to the two chip pads and including an antenna connected to the carrier pads and electrically connected to the chip pads and to the RF core. The antenna is formed of wires, printed conductors, seal rings or other structures on, below or above the top plane of the semiconductor chip. A primary element is provided where the RF element is a secondary element. The primary element occupies a primary region and the RF core of the secondary element occupies a secondary region where the secondary region is much smaller than the primary region. The RF core secondary region is formed with the same native processing as used for the primary element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.