Electronic device with flexible heat spreader
US7608923B2 · kind B2 · utility
7Cited by
12References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 12, 2007 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Oct 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat spreader conformally covers the surface of the substrate and the die. The invention also discloses an electronic device with the package module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.