Wafer transfer apparatus
US7611182B2 · kind B2 · utility
16Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2005 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Feb 25, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer transfer apparatus may include a robot arm unit configured to be operated by a driving means, a blade configured to support a wafer and having a fix finger at a first end, and a clamping member attached to the robot arm. The clamping arm may also include a movable finger configured to hold a peripheral edge of the wafer, and a moving pusher attached to the movable finger and configured to guide the movable finger and the wafer on the blade towards the fix finger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.