Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors
US7611754B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2002 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Sep 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/00
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A microdeposition system microdeposit droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define subfeatures of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.