Bonding interface for micro-device packaging
US7611919B2 · kind B2 · utility
1Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2005 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Oct 4, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/051
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.