Method of manufacturing display device
US7611930B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2008 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Aug 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6729
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a case of forming a bottom-gate thin film transistor, a step of forming a microcrystalline semiconductor film over a gate insulating film by a plasma CVD method, and a step of forming an amorphous semiconductor film over the microcrystalline semiconductor film are performed. In the step of forming the microcrystalline semiconductor film, the pressure in the reaction chamber is set at or below 10−5 Pa once, the substrate temperature is set in the range of 120° C. to 220° C., plasma is generated by introducing hydrogen and a silicon gas, hydrogen plasma is made to act on a reaction product formed on a surface of the gate insulating film to perform removal while performing film formation. Moreover, the plasma is generated by applying a first high-frequency electric power of an HF band a second high-frequency electric power of a VHF band superimposed on each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.