Dual pulsed beam laser micromachining method
US7611966B2 · kind B2 · utility
5Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2005 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Dec 22, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/268
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method is described for laser scribing or dicing portions of a workpiece using multi-source laser systems. In one embodiment, a first laser melts portions of the workpiece prior to a second laser ablating the portions of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.