Defectivity and process control of electroless deposition in microelectronics applications
US7611988B2 · kind B2 · utility
3Cited by
42References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2005 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Nov 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and compositions for electrolessly depositing Co, Ni, or alloys thereof onto a substrate in manufacture of microelectronic devices. Grain refiners, levelers, oxygen scavengers, and stabilizers for electroless Co and Ni deposition solutions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.