Nicolai Petrov
9Patents
6h-index
11Co-inventors
49Inventor score
Filing activity: Jun 21, 2002 → Oct 5, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6902605B2 | Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper | Electricity | 29 | Expired |
| US6794288B1 | Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation | Electricity | 28 | Expired |
| US6911067B2 | Solution composition and method for electroless deposition of coatings free of alkali metals | Chemistry; Metallurgy | 14 | Expired |
| US7332193B2 | Cobalt and nickel electroless plating in microelectronic devices | Electricity | 8 | Expired |
| US7410899B2 | Defectivity and process control of electroless deposition in microelectronics applications | Electricity | 7 | Expired |
| US6875691B2 | Temperature control sequence of electroless plating baths | Electricity | 7 | Expired |
| US7611987B2 | Defectivity and process control of electroless deposition in microelectronics applications | Electricity | 3 | Active |
| US7611988B2 | Defectivity and process control of electroless deposition in microelectronics applications | Electricity | 3 | Active |
| US7615491B2 | Defectivity and process control of electroless deposition in microelectronics applications | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.