High power light emitting diode device
US7612386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2006 |
| Grant date | Nov 3, 2009 |
| Priority date | — |
| Expiry date | Sep 25, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.