Method of evaluating adhesion property, low-adhesion material, and mold for molding resin
US7614293B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 3, 2005 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Sep 3, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2839
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mold surface of an upper mold with which a fluid resin comes into contact has an oxide therein. The oxide contains a metal cation and an ion. Field strength is calculated based on a valence of the metal cation and ionic radius of the ion. Based on predetermined relationship established between a value of the field strength and adhesion strength between a cured resin and the mold surface, releasability between the cured resin and the mold surface is evaluated. Thereby, a method of evaluating releasability between the cured resin and the mold surface is established. With this evaluation method, a material with high releasability can readily be provided. Further, if the material with high releasability is used for the mold surface of the upper mold, a mold for molding a resin having excellent releasability can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.