Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip
US7615832B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2007 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Mar 13, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.