Solder flow stops for semiconductor die substrates
US7615873B2 · kind B2 · utility
1Cited by
21References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2005 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Nov 7, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to prevent die rotation during solder reflow. The at least one solder stop is non-wetting, during a solder reflow process, to solder used to mount the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.