Method for performing pattern pitch-split decomposition utilizing anchoring features

US7617476B2 · kind B2 · utility

Assignee

• ASML Masktools B.V. · NL

Inventors

• Duan-Fu Stephen Hsu · Fremont, US
• Noel Corcoran · San Jose, US
• Jang Fung Chen · Cupertino, US
• Douglas Van Den Broeke · Sunnyvale, US

Key dates

• Filing date: Sep 13, 2007
• Grant date: Nov 10, 2009
• Expiry date: Jan 29, 2028

Classification

• Technology area (CPC G): Physics
• CPC primary: G03F7/70433
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method for decomposing a target pattern containing features to be printed on a wafer into multiple patterns. The method includes the steps of: (a) determining a minimum critical dimension and pitch associated with a process to be utilized to image the multiple patterns; (b) generating an anchoring feature; (c) disposing the anchoring feature adjacent a first feature of the target pattern; (d) growing the anchoring feature a predetermined amount so as to define a first area; (e) assigning any feature within the first area to a first pattern; (f) disposing the anchoring feature adjacent a second feature of the target pattern; (g) growing the anchoring feature the predetermined amount so as to define a second area; and (h) assigning any feature within the second area to a second pattern. Steps (c)-(h) are then repeated until the densely spaced features within the target pattern have been assigned to either the first or second pattern.