Apparatus and method for performing predetermined processing on substrate with ultrasonic waves
US7617833B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2005 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Nov 28, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/12
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A blocking plate 3 is disposed opposing a substrate W which is held by plural chuck pins 17 and a processing liquid is supplied from a processing liquid nozzle 5 to a space SP between the front surface Wf of the substrate and an opposed surface 3a of the blocking plate 3, whereby the processing liquid attains the liquid-tight state. While the liquid-tight state with the processing liquid is maintained, the substrate W and the blocking plate 3 rotate. In this condition, a liquid (pure water) to which ultrasonic vibration has propagated is injected from an ultrasonic nozzle 7 approximately perpendicular to a side wall surface 3b of the blocking plate 3. While the ultrasonic vibration spreads inside the blocking plate 3 along the horizontal direction, some vibrational waves spread uniformly and widely from the opposed surface 3a to the processing liquid attaining the liquid-tight state and vibrate the processing liquid. This prevents concentration of the vibrational energy at the front surface Wf, which makes it possible to uniformly process the substrate W while suppressing damage to the substrate W.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.