Insulating material for printed circuit board
US7618553B2 · kind B2 · utility
18Cited by
0References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2007 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Jan 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is an insulating material for a printed circuit board, including a liquid crystal polyester resin and ceramic powder, thus exhibiting a temperature coefficient of capacitance ranging from −300 to +300 ppm/° C. in the temperature range of −55˜125° C. and a dielectric constant ranging from 5 to 40. This insulating material has superior dielectric properties, and a small change in dielectric constant depending on the change in temperature, and thus exhibits high reliability when applied to high-frequency circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.