Process for polishing glass substrate
US7622050B2 · kind B2 · utility
7Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Dec 22, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C15/02
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process for polishing a glass substrate required to have high-degree of flatness and smoothness, is provided. A preliminarily polished glass substrate is applied with a surface treatment by a first-step gas-cluster ion beam etching to improve the flatness, and then, the glass substrate is applied with a surface treatment by a second-step gas-cluster ion beam etching having different irradiation conditions of those of the first-step gas-cluster ion beam etching to improve the surface roughness, whereby the glass substrate is finish-polished to have a flatness of at most 0.05 μm and a surface roughness (Rms) of at most 0.25 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.