Integrated circuit and method of manufacturing an integrated circuit

US7622354B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Lars Dreeskornfeld · Dresden, DE
• Jessica Hartwich · Neubiberg, DE
• Tobias Mono · Dresden, DE
• Arnd Scholz · Poughkeepsie, US
• Stefan Slesazeck · Dresden, DE

Key dates

• Filing date: Aug 31, 2007
• Grant date: Nov 24, 2009
• Expiry date: Aug 31, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10D86/03

Abstract

An integrated circuit including a memory device comprises an array portion comprising memory cells and conductive lines, an upper surface of the conductive lines being disposed beneath a surface of a semiconductor substrate, and a support portion comprising transistors of a first type, the transistors of the first type comprising a first gate electrode including vertical portions that are vertically adjacent to a channel of the transistor of the first type.