Hermetic feedthrough terminal assembly with wire bond pads for human implant applications
US7623335B2 · kind B2 · utility
45Cited by
49References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Feb 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/35
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.