Method of real time dynamic CD control
US7625680B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Jan 25, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/4788
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of real time dynamic CD control in a system for heat-treating resist coated wafers on a hotplate. The method includes establishing a temperature profile for a hotplate surface, where the hotplate surface is divided into a plurality of temperature control zones, and sequentially heat-treating the resist coated wafers on the hotplate. The method further includes obtaining CD metrology data from test areas on the heat-treated wafers, where different groups of test areas are selected for two or more of the heat-treated wafers. A CD metrology data map is constructed using the CD metrology data and an adjusted temperature profile is established for the hotplate surface using the CD metrology data. Additional wafers are then heat-treated on the hotplate. The method also may be applied to heat-treating resist coated wafers on a plurality of hotplates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.