Method of fabricating a carbon nanotube interconnect structures
US7625817B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2005 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Dec 28, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/75
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method including forming an interconnect of single-walled carbon nanotubes on a sacrificial substrate; transferring the interconnect from the sacrificial substrate to a circuit substrate; and coupling the interconnect to a contact point on the circuit substrate. A method including forming a nanotube bundle on a circuit substrate between a first contact point and a second contact point, the nanotube defining a lumen therethrough; filling a portion of a length of the lumen of the nanotube bundle with an electrically conductive material; and coupling the electrically conductive material to the second contact point. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board, the microprocessor including a substrate having a plurality of circuit devices with electrical connections made to the plurality of circuit devices through interconnect structures including carbon nanotube bundles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.