Inventor · Portland, OR, US

Juan E. Dominguez

28Patents
7h-index
29Co-inventors
65Inventor score

Filing activity: Aug 9, 2004 → Aug 21, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7220671B2 Organometallic precursors for the chemical phase deposition of metal films in interconnect applications Electricity 46 Expired
US7964174B2 Nanotube growth and device formation Emerging Cross-Sectional Technologies 28 Active
US7682891B2 Tunable gate electrode work function material for transistor applications Electricity 16 Active
US7635503B2 Composite metal films and carbon nanotube fabrication Emerging Cross-Sectional Technologies 13 Active
US7354849B2 Catalytically enhanced atomic layer deposition process Electricity 8 Expired
US7459392B2 Noble metal barrier and seed layer for semiconductors Electricity 7 Expired
US7851360B2 Organometallic precursors for seed/barrier processes and methods thereof Electricity 7 Active
US8319287B2 Tunable gate electrode work function material for transistor applications Electricity 6 Active
US7687911B2 Silicon-alloy based barrier layers for integrated circuit metal interconnects Electricity 5 Active
US7858525B2 Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill Electricity 4 Active
US8222746B2 Noble metal barrier layers Electricity 4 Active
US7964746B2 Copper precursors for CVD/ALD/digital CVD of copper metal films Chemistry; Metallurgy 3 Active
US7550385B2 Amine-free deposition of metal-nitride films Electricity 3 Expired
US8425987B2 Surface charge enhanced atomic layer deposition of pure metallic films Chemistry; Metallurgy 2 Active
US7625817B2 Method of fabricating a carbon nanotube interconnect structures Emerging Cross-Sectional Technologies 2 Active
US7476615B2 Deposition process for iodine-doped ruthenium barrier layers Electricity 2 Active
US7749906B2 Using unstable nitrides to form semiconductor structures Emerging Cross-Sectional Technologies 2 Active
US7435679B2 Alloyed underlayer for microelectronic interconnects Electricity 1 Expired
US7507521B2 Silicon based optically degraded arc for lithographic patterning Electricity 1 Expired
US10790257B2 Active package substrate having anisotropic conductive layer Electricity 1 Active
US7704895B2 Deposition method for high-k dielectric materials Electricity 1 Active
US11145632B2 High density die package configuration on system boards Electricity 1 Active
US10497669B2 Hybrid die stacking Electricity 0 Active
US8344352B2 Using unstable nitrides to form semiconductor structures Emerging Cross-Sectional Technologies 0 Active
US7687225B2 Optical coatings Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.