Image sensing module with improved assembly precision
US7626160B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2006 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Jan 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8592
Abstract
An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.