Altus Technology Inc.
23Patents
21Active
23Granted
48Portfolio score
Filing activity: Dec 14, 1988 → Jan 31, 2007 · 21 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US4881873A | Capacitance level sensor for a bilge pump | Mechanical Engineering; Lighting; Heating | 31 | Expired |
| US7408205B2 | Digital camera module | Electricity | 12 | Active |
| US7502183B2 | Lens module and camera module using the same | Electricity | 8 | Active |
| US7417810B2 | Lens module with shielding layer | Physics | 8 | Active |
| US7460317B2 | Digital camera module with improved image quality | Physics | 6 | Active |
| US7361880B2 | Digital camera module for detachably mounting with flex printed circuit board | Electricity | 6 | Active |
| US7643081B2 | Digital camera module with small sized image sensor chip package | Electricity | 6 | Active |
| US7374431B2 | Clamping device for digital camera module | Electricity | 4 | Active |
| US7365421B2 | IC chip package with isolated vias | Electricity | 4 | Active |
| US7595839B2 | Image sensor chip packaging method | Electricity | 3 | Active |
| US7554184B2 | Image sensor chip package | Electricity | 3 | Active |
| US8059155B2 | System and method for measuring field of view of digital camera modules | Electricity | 2 | Active |
| US7614807B2 | Electronic camera mechanism | Electricity | 2 | Active |
| US7342215B2 | Digital camera module package fabrication method | Electricity | 2 | Active |
| US7646429B2 | Digital camera module packaging method | Electricity | 2 | Active |
| US7540672B2 | Digital still camera module | Electricity | 1 | Active |
| US7417327B2 | IC chip package with cover | Electricity | 1 | Expired |
| US7626160B2 | Image sensing module with improved assembly precision | Electricity | 1 | Active |
| US7592197B2 | Image sensor chip package fabrication method | Electricity | 0 | Active |
| US7639303B2 | Method and apparatus for lens auto-focusing in camera module test | Physics | 0 | Active |
| US8072489B2 | Digital camera module using stacked chip package | Electricity | 0 | Active |
| US7538862B2 | Testing system for digital camera modules | Electricity | 0 | Active |
| US7515254B2 | Reflection-testing device and method for use thereof | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.