Microelectronic die assembly having thermally conductive element at a backside thereof and method of making same
US7626251B2 · kind B2 · utility
1Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2006 |
| Grant date | Dec 1, 2009 |
| Priority date | — |
| Expiry date | Apr 12, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic die assembly. The die assembly includes a microelectronic die, and a thermally conductive element attached to the backside of the die with a thermal interface material. The thermally conductive element has lateral dimensions smaller than, substantially equal to, or larger than lateral dimensions of the die by up to a maximum amount, wherein the maximum amount is adapted to allow a mounting of the die assembly to a package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.