Method for making a multilayered circuitized substrate
US7627947B2 · kind B2 · utility
4Cited by
31References
13Claims
0Family size
Assignee
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Key dates
| Filing date | May 2, 2007 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Feb 28, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.