Method of replenishing an oxidation suppressing element in a solder bath
US7628308B2 · kind B2 · utility
3Cited by
8References
7Claims
0Family size
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Key dates
| Filing date | Jan 8, 2003 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Sep 26, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3468
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.