Structure and process for a contact grid array formed in a circuitized substrate
US7628617B2 · kind B2 · utility
65Cited by
240References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Sep 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10946
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.