RFID temperature sensing wafer, system and method
US7629184B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 20, 2007 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Mar 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68714
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing semiconductor wafers is provided that comprises processing a semiconductor wafer to form at least one temperature-sensing RF device on the wafer and further processing the wafer to form a plurality of semiconductor products on the wafer while sensing temperature on the wafer with the formed RF device and wirelessly transmitting data from the RF device. Semiconductor wafers made according to the method are provided having at least one active RFID temperature-sensing device and semiconductor device products formed thereon. The RFID devices are located on portions of the wafer that are disposable when the semiconductor device products are cut from the wafers. A semiconductor wafer processing apparatus is provided having an RF antenna and transmitter and receiver circuits that communicate with RF devices on a wafer during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.