Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion
US7629652B2 · kind B2 · utility
12Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Feb 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15788
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Signal lines which provide electric connections from an internal circuit formed on a main surface of a semiconductor chip and including, for example, MIS transistor to protective elements constituted by, for example, diodes are drawn out from outlet ports formed on wiring lines disposed between the protective elements, and a signal line region occupied by the signal lines is provided over the protective elements and under electrode pads. A wiring region on the main surface of the semiconductor chip can be enlarged without increasing the chip area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.