System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices
US7629675B2 · kind B2 · utility
7Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Sep 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit includes a first and a second die positioned on a lead frame of a package. The lead frame includes a plurality of bond fingers. The integrated circuit includes a first bond pad on the first die that is electrically interconnected to a corresponding second bond pad on the second die through first and second bond fingers of the lead frame. The package may be a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.