Adjustable thickness thermal interposer and electronic package utilizing same
US7629684B2 · kind B2 · utility
14Cited by
15References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jun 4, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package which includes a substrate (e.g., a chip carrier substrate or a PCB), an electronic component (e.g., a semiconductor chip), a heatsink and a thermal interposer for effectively transferring heat from the chip to the heatsink. The interposer includes a compressible, resilient member (e.g., an elastomeric pad) and a plurality of thin, metallic sheets (e.g., copper foils) and the thickness thereof can be adjusted by altering the number of such foils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.