Bonded structure and bonding method
US7629688B2 · kind B2 · utility
1Cited by
1References
19Claims
0Family size
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Key dates
| Filing date | Jul 24, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jan 7, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.