Hisaki Fujitani
12Patents
1h-index
13Co-inventors
47Inventor score
Filing activity: Nov 24, 2004 → May 22, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7298045B2 | Stacked semiconductor device | Electricity | 18 | Expired |
| US7629688B2 | Bonded structure and bonding method | Electricity | 1 | Active |
| US9799803B2 | LED module with multi-layer resist | Electricity | 1 | Active |
| US10103298B2 | LED module | Electricity | 0 | Active |
| US9368706B2 | Substrate, light-emitting device, illuminating light source, and lighting apparatus | Electricity | 0 | Active |
| US10260687B2 | Light-emitting module and lighting fixture | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US9761766B2 | Chip on board type LED module | Electricity | 0 | Active |
| US8012869B2 | Bonded structure and bonding method | Electricity | 0 | Active |
| US9741915B2 | LED module having LED element connected to metal layer exposed by opening in multi-layer resist | Electricity | 0 | Active |
| US9728695B2 | Mount substrate and LED module with the same | Electricity | 0 | Active |
| US7495339B2 | Connection structure and method for fabricating the same | Electricity | 0 | Active |
| US10490721B2 | Light-emitting device and illuminating apparatus | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.